题目内容
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A、increses the secretion salivary juice
B、increses the secretion of gastric juice
C、promotes the gastric motility
D、increases the pancretic juice secretion
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更多“The functions of gastrin do not include:”相关的问题
A.Cools the inert gas
B.Maintains the oxygen content at 5% by volume
C.Drains off static electricity in the inert gas
D.Maintains the water seal on the gas main
A.FVF
B.Viscosity
C.Compressibility
D.density
For example, people have for many years been using the reflected（反射的）heat of the sunto cook. Solar（太阳能的）cookers have been built with several special mirrors reflecting the sunand centering its heat on the cooking part. This equipment can be used just like a gas or electriccooker: it is more expensive to make but it does not need any fuel, and so costs nothing to use. Another possibility of using solar energy is in house heating.
The form. of energy we use must is electricity, and every day more is needed. But electricityalso has to be made, and to make it, huge quantities of fuel are required —oil, coal, gas and soon.
The question which worries everyone today is: how long will these fuels last？ Nobodyknows for sure, but most experts think it will soon be difficult to get enough electricity fromthese sources. It is possible that the sun can make a contribution here, too.
Solar power has already been used to produce powerful heat. In Southern France a solarfurnace（锅炉）has been built, where temperatures reach more than 3000℃. This furnace is onlyused for experiments at present, but could be used to produce steam for a power station.
So it is possible that one day in the near future we will depend on solar furnaces and powerstations to provide our electrical needs. Or perhaps each home will be able to use solar power forlighting and heating.
According to Paragraph 1, the sun can provide electricity because ______.
A.it gives us warmth
B.it gives us brightness
C.it has plenty of power
D.it has plenty of gas
One advantage of a solar cooker is that ______.A.no fuel is needed
B.no mirror is needed
C.no heat is needed
D.no space is needed
According to Paragraph 4, most experts think that fuels on the earth ______.A.are always available
B.are limited
C.are expensive
D.are always useful
The underlined sentence in Paragraph 4 means that the sun may provide us with ______.A.enough fuels
B.enough steam
C.enough oil
D.enough electricity
This passage is mainly about ______.A.the problems of solar energy
B.the functions of solar power
C.the use of house heating
D.the forms of energy
请帮忙给出每个问题的正确答案和分析，谢谢！
A、平面布置的任务就是要综合解决场地的规划和整治，房屋与构筑物的合理配置，在符合工艺要求的前提下完成道路、工艺管网和其它各种辅助系统管网的合理安排，并保证这些规划布局和安排同当地的地形地质条件相适应。The task of plane layout is to comprehensively solve the planning and renovation of the site, reasonable configuration of houses and structures, and complete the reasonable arrangement of roads, process pipe network and other auxiliary system pipe network on the premise of meeting the technological requirements, and ensure that the planning layout and arrangement are in line with the local topographic and geological conditions.
B、按设施功能划分多个区块Divide multiple blocks according to facility functions
C、多用撬装区块：工厂预制并调试好，现场快速安装。可缩短工期，节省投资，占地面积少。Multi-purpose pry block: factory prefabrication and debugging, quick installation on site. It can shorten the construction period, save investment and cover less land.
D、以上都不对
听力原文： Many people tend to disregard the exhaust system of an automobile. They may think that the exhaust system does nothing more than to discharge the waste products of the combustion process. Although this is exactly what the exhaust system does, the way these waste product is discharged out of the engine is essential to the performance of the engine. A gasoline engine involves three processes: combustion, mechanical drive and exhaust. If one of these processes is impeded, the condition of the engine will depreciate. The exhaust system has three major functions, the first of which is to channel out the waste products of combustion out of the engine to allow it to continue to burn fuel unhindered thereby ensuring that the engine runs smoothly. An efficient exhaust system allows the waste gas and compound to escape quickly out of the system. If these waste products do not escape from the engine immediately, they may choke up the engine thus causing it to break down. Another function of the exhaust system is to reduce the noise generated by the engine. The third function of the exhaust system is to clean up the emissions that are harmful to the environment. When the engine burns fuel, it produces gases that pollute the air such as hydrocarbons, carbon monoxide and nitrogen oxides.
What is the passage mainly about？
A．The exhaust system of a car.
B．Waste gas.
C．The car engine.
D．Air pollution.
(2) 3D Heterogeneous Integration Every logic generation needs to add new functions in each node to keep unit price constant (to preserve margins). This is getting more difficult due to the following challenges: • Little functions left on board/system to co-integrate • Heterogeneous cores specialized per function—specialized performance improvement requirements needed per each dedicated core • Off-package memories—costly to co-integrate with logic, technology not fitting to baseline CMOS (where wafer/die-level stacking might be needed) Die cost reduction has been enabled so far by concurrent scaling of poly pitch, metal pitch, and cell height scaling. This would like to continue until 2024. Cell height scaling would likely to be pursued by 3D device (e.g., finFET and lateral GAA), device stacking, 3DVLSI, and design-technology-co-optimization (DTCO) constructs in cell and physical design. However, this scaling route will become challenged by diminishing electrical/system benefits and also by diminishing areareduction/$ at SoC level. Therefore, it is necessary to pursue 3D integration routes such as device-over-device stacking and/or monolithic 3D (or sequential integration) These pursuits will maintain system performance and power gains while maintaining the cost advantages such as treating expensive non-scaled components somewhere else and using the best technology fit per tier functionality. 3DVLSI offers the possibility to stack devices enabling high-density contacts at the device level (up to 100 million vias per mm² with N14 ground rules). 3DVLSI can be routed either at gate or transistor levels. The partitioning at the gate level allows IC performance gain due to wire length reduction while partitioning at the transistor level by stacking nFET over pFET (or the opposite), enabling the independent optimization of both types of transistors (customized implementation of channel material/substrate orientation/channel and raised source/drain strain, etc.) while enabling reduced process complexity compared to a planar co-integration, for instance the stacking of III-V nFETs above SiGe pFETs. These high mobility transistors are well suited for 3DVLSI because their process temperatures are intrinsically low. 3DVLSI, with its high contact density, can also enable applications requiring heterogeneous co-integration with high-density 3D vias, such as NEMS with CMOS for gas sensing or highly miniaturized imagers. In order to address the transition from 2D to 3DVLSI, the following generations are projected in the IRDS roadmap: • Die-to-wafer and wafer-to-wafer stacking o Approach: Fine-pitch di-electric/hybrid bonding and/or flip-chip assembly o Opportunities: Reducing bill-of-materials on the system, heterogenous integration o Challenges: Design/architecture partitioning • N&P stacking o Approach: Sequential integration o Opportunities: Reducing 2D footprint of standard cell o Challenges: Minimizing interconnect overhead is key between N&P enabling low-cost • Adding logic 3D SRAM and/or MRAM stack (embedded/stacked) o Approach: Sequential integration and/or wafer transfer o Opportunities: 2D area gain, better connection between logic and memory enabling system latency gains. o Challenges: Solving the thermal budget of interconnect at the lower tier if stacking approach is used, Revisiting the cache hierarchy and application requirements, power, and clock distribution • Adding Analog and I/O o Approach: Sequential integration and/or wafer transfer o Opportunities: Giving more freedom to designer and allows integration of high-mobility channels, pushing non-scaling components to another tier, IP re-use, scalability, IO voltage enablement in advanced nodes o Challenges: Thermal budget, reliability requirements, power and clock distribution • True-3D VLSI: Clustered functional stacks, beyond CMOS adoption o Approach: Sequential integration and/or wafer transfer o Opportunities: Complementary functions other than CMOS replacement such as neuromorphic, highbandwidth memory. Application examples include image recognition in neuromorphic fabric and wideIO sensor interfacing (e.g., DNA sequencing, molecular analysis). o Challenges: Architecting the application where low energy at low frequency and highly-parallel interfaces could be utilized, mapping applications to non-Von Neumann architectures. 1) Which of the following may not be the challenge to add new functions in each node of logic generation？ () A Little functions left on board/system to co-integrate B Heterogeneous cores specialized per function—specialized performance improvement requirements needed per each dedicated core C Technology not fitting to baseline CMOS D SRAM and FLASH memories 2) Which of the following may not reduce the die cost？ () A Scaling of pecialized performance B Scaling of poly pitch C Scaling of metal pitch D Scaling cell height 3) Cell height scaling would likely to be pursued by () A 3D device B Device stacking C 3DVLSI D all of the above 4) 3D integration routes may not include () A device-over-device stacking B scaling of poly pitch C sequential integration D monolithic 3D 5) We can maintain the cost advantages by () for 3D integration. A using new materials for channel B using high κ dielectrics for gate C treating expensive non-scaled components somewhere else D Moore’s Law 6) According to the author, which of the following is false？ () A 3DVLSI may achieve high-density contacts at the device level. B 3DVLSI can be routed either at gate or transistor levels. C 3DVLSI allows IC performance gain due to wire length reduction D 3DVLSI may enable the optimization of one type of transistors. 7) What is the challenge for monolithic 3D integration？ () A Design of the system B Architecture C Minimizing interconnect overhead D Applications requiring heterogeneous co-integration with high-density 3D vias 8) What is the advantage of the N&P stacking？ A Reducing bill-of-materials on the system B Reducing 2D footprint of standard cell C Reducing the thermal budget of interconnect D All of the above 9) According to the author, which of the following can achieve the 2D area gain？ () A Logic 3D SRAM and/or MRAM stack B Scaling of poly pitch C Scaling of metal pitch D All of the above 10) The author implies that neuromorphic may () A be realized by wafer transfer. B be realized by CMOS solution. C be used in Von Neumann architectures. D be a highbandwidth memory.
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